A recent report from Korea suggests that Google’s upcoming Tensor G4 chip will incorporate a new packaging technique from Samsung, potentially leading to improvements in power efficiency and heat management.
According to Financial News, which cites industry insiders, Google and Samsung are collaborating on the development of the Tensor G4 chip, with plans to utilize Samsung’s latest 4nm process and packaging method.
Specifically, the Tensor G4 is expected to employ an updated Fan-out Wafer Level Packaging (FOWLP) method. The report indicates that this advancement will result in enhanced heat management and power efficiency compared to previous iterations.
It’s worth noting that Tensor G3 also utilized a version of this packaging method, which contributed to its superior heat management performance.
Previous reports have suggested that Tensor G4 will represent a minor upgrade over the existing G3 chip. If improvements in heat and power efficiency are indeed among the key enhancements, it bodes well for the upcoming release. Additionally, there are indications that Google plans to transition away from Samsung with the introduction of Tensor G5 in the Pixel 10 series in 2025. This future chip is expected to be produced by TSMC, known for its superior power efficiency, as seen in chips developed by Qualcomm and MediaTek.
